Days: Monday, December 15th Tuesday, December 16th Wednesday, December 17th
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【Sponsor Seminar 1】AI driven design and 3D-IC design automation
Tadaaki Hitomi （Cadence）
【Keynote Speech 1】Beyond Moore's Law: The Chiplet Revolution in Semiconductor Packaging
Yasumitsu Orii (Rapidus)
【Tutorial 1】Fundamentals of Electrical Design for Advance Packaging and Heterogeneous Integration
Rohit Sharma (Indian Institute of Technology Ropar)
【Tutorial 2】The Evolution of mmWaveAntenna in Package Toward a Connected Intelligent Future
Atom O. Watanabe (IBM T.J. Watson Research Center)
【Tutorial 3】Fundamentals of Machine Learning and Macromodeling for High-Speed Interconnects and Advanced Packaging
Tom Dhaene and Thijs Ullrick (Ghent University - imec)
View this program: with abstractssession overviewtalk overview
【Opening Remarks】
Hideki Sasaki (Rapidus)
【Keynote Speech 2】Heterogeneous Integration - A Means to continue Moore's Law
Madhavan Swaminathan (Penn State University)
Oral Session1: Next Generation Memory Devices and their Interconnection
| 10:40 | Design of Chiplet Interconnects Considering Crosstalk Induced from Meshed Ground Plane (abstract) PRESENTER: Jiwoon Moon |
| 11:00 | Signal Integrity Analysis of High-Speed Chiplet Interconnection Considering Surface Roughness Based on Huray Model (abstract) PRESENTER: Jonghyeon Lee |
| 11:20 | Mem-Village: A Hybrid HBF-HBM Architecture on Glass for Ultra-Scale AI Inference Systems (abstract) PRESENTER: Hyuni Lee |
| 11:40 | Compact and robust holographic memory for optically reconfigurable gate arrays (abstract) PRESENTER: Minoru Watanabe |
【Sponsor Seminar 2】 Design Environment for Advanced packaging
Yoko Fujita （Zuken）
Oral Session 2: Single and Power Integrity
| 13:30 | Electrical Performance of Interconnects in an Organic Interposer Targeted for Chiplet Applications (abstract) PRESENTER: Ying Ying Lim |
| 13:50 | Uncertainty Quantification Using Riemannian Tensor Train Completion for Polynomial Chaos (abstract) PRESENTER: Ziyuan Wang |
| 14:10 | Verification of channel crosstalk suppression effects due to differences in cable length using mode-division multiplexed transmission method (abstract) PRESENTER: Hayato Yatabe |
| 14:30 | Estimation of Power Bus Resonance Suppression by Lossy Resonator Filter in the Wi-Fi Band Using Equivalent Circuit Model (abstract) PRESENTER: Sho Kanao |
Oral Session3: Advanced Packaging
| 15:00 | A Novel Study on the Effect of Temperature Cycle Testing on the Transmission Performance of Sub-2 micron Fine-Wiring for Glass Substrates (abstract) PRESENTER: Masaya Tanaka |
| 15:20 | Compact 3D-SiP Power IC Packaging with Thermal Performance Improvement (abstract) PRESENTER: Poyu Tsai |
| 15:40 | Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging (abstract) PRESENTER: Fong-Rong Bai |
| 16:00 | Asymmetric Organic Cores to Reduce Semiconductor Substrate Warpage (abstract) PRESENTER: Ryota Yambe |
Poster Session
20-H Rule of Power Ground Plane of Printed Circuit Board and Clustering of Electric Near-Field Distribution (abstract) |
Statistical Eye-Diagram Estimation Method for PAM-4 Based High-speed Channel Considering Crosstalk (abstract) PRESENTER: Yuchul Jung |
Achieving 32 Gbps in UCIe-S 2D-Packaging Based on Microstrip Routing on Glass Substrates (abstract) PRESENTER: Yuchi Yang |
Guided by Uncertainty: Adaptive Frequency Sampling Using Gaussian Processes (abstract) PRESENTER: Thijs Ullrick |
Comprehensive Characterization of Inkjet Printer Ag Film on Paper Substrate for Sensor Electrodes (abstract) PRESENTER: Akanksha Arya |
Probed Measurement Techniques for 100 Gbit/s D-band Wireless Link Experiments (abstract) PRESENTER: Samuel Rimbaut |
Pressure-Bonding of GaN-HEMT Die to Graphite Carbon for heat dissipation (abstract) PRESENTER: Koji Aramaki |
Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator (abstract) PRESENTER: Masaki Hashizume |
Effect of Wiring Geometry Modification on Signal Integrity in Silicon-Interposer Interconnect (abstract) PRESENTER: Yosei Kawamoto |
Physics-Intuitive Micro-Modeling Circuits (MMC) for Fast Analysis of Finite Dielectric Problems (abstract) PRESENTER: Chengyi Cao |
View this program: with abstractssession overviewtalk overview
【Keynote Speech 3】Recent Developments and Future Trends in HBM for AI Applications
Stephen Morein (SAIMEMORY Corp.)
【Keynote Speech 4】AI for Signal and Power Integrity: From Physics-Guided Learning to Intelligent Electronics Design
En-Xiao Liu (A*STAR Institute of High Performance Computing)
Oral Session 4: Machine Learning and EDA
| 10:40 | Memory-Encoded DeepONet (M-DeepONet) for Transient Circuit Behavioral Modeling (abstract) PRESENTER: Xu Chen |
| 11:00 | Chiplet Placement and Routing Agent for UCIe Interfaces Considering Thermal and Signal Integrity (abstract) PRESENTER: Hyunseo Uhm |
| 11:20 | Switch Transformer-based Reinforcement Learning Method for Power Supply Induced Jitter (PSIJ) Reduction in High Bandwidth Memory (HBM) (abstract) PRESENTER: Jaegeun Bae |
| 11:40 | Hierarchical Reinforcement Learning-based Co-Optimization of Package Substrate Design for Multiple Power Domain 3D-ICs (abstract) PRESENTER: Seunghun Ryu |
【Sponsor Seminar 3】System Engineering in the Silicon to Systems era
Jayraj Nair （ANSYS）
TC Session: Activities of the IEEE EPS Technical Committee on Electrical Design, Modeling, and Simulation
Antonio Maffucci (University of Cassino and Southern Lazio, Cassino)
Xu Chen (University of Illinois)
Hideki Sasaki (Rapidus)
Oral Session 5: RF and Antenna in Package
| 13:30 | Robust High-Frequency Wirebonding of a Power Amplifier to a Wideband D-band Antenna Array (abstract) PRESENTER: Samuel Rimbaut |
| 13:50 | Tunable Graphene based Terahertz Bandstop Filter for Semiconductor Packaging Applications (abstract) PRESENTER: G Challa Ram |
| 14:10 | A Velocity-Aware Density Peaks Clustering Method with Curb Filtering for Millimeter-Wave Radar (abstract) PRESENTER: Shixian Su |
| 14:30 | High-Performance Horizontally Polarized Bow-Tie Slot Antenna for Next-Generation Wi-Fi 7 Systems (abstract) PRESENTER: Hao Deng |
Oral Session 6: EMI Countermeasures
| 15:00 | Suppression of Connector Radiation Coupling to Antenna by Phase Cancellation (abstract) PRESENTER: Chih-Yu Fang |
| 15:20 | Design and Measurement of Ultra-wideband Bidirectional Absorptive Common Mode Filter (abstract) PRESENTER: Akihiro Narushima |
| 15:40 | Design of a Hybrid Common-Mode Filter Based on Electromagnetic Bandgap and Defected Ground Structure for Wideband Noise Suppression (abstract) PRESENTER: Jinwook Lee |
| 16:00 | An Ultra-Lightweight CNT-Aerogel Absorber for Broadband Noise Suppression on High-Speed Packages (abstract) PRESENTER: Sho Muroga |
Award Ceremony ＆Closing Remarks
Hideki Sasaki